报告题目：Differential Microstrip Antennas
ABSTRACT: In this lecture, I present differential microstrip antennas with an emphasis on the comparison of them with single-ended counterparts. First, I extend the well-known cavity model for the single-ended microstrip antennas to analyze the input impedance and radiation characteristics of differential microstrip antennas. Then I examine the design formulas to determine the patch dimensions and the location of the feed point for single-ended microstrip antennas to design differential microstrip antennas. It is shown that the patch length can still be designed using the formulas for the required resonant frequency but the patch width calculated by the formula usually needs to be widen to ensure the excitation of the fundamental mode using the probe feeds. The condition that links the patch width, the locations of the probe feeds, and the excitation of the fundamental mode is the electrical separation, which is a new and unique concept specifically conceived for the design of differential microstrip antennas. Next, I turn to the miniaturization of differential microstrip antennas and discuss some latest achievements. Finally, I summarize the lecture and provide recommendations.
报告题目：Wireless Chip Area Network (WCAN): A New Paradigm for RF Microelectronics and Radio Communications
ABSTRACT: Considering the trend of wireless area network shrinkage in coverage to increase capacity and speed, Zhang proposed the concept of wireless chip area network (WCAN) in 2002. WCAN uses wireless technology to overcome the bottleneck of wired technology to realize interconnects among circuit cores in a chip (Intra-chip) or among different chips in a module (Inter-chip). WCAN, as a new paradigm for wireless communications and RF microelectronics, has begun to receive considerable attention recently. This talk will provide an introduction to WCAN. Emphasis will be given to the fundamental research in the characterization of chip-scale radio channels for WCAN. It is shown that the guided waves dominate the chip-scale radio propagation. This talk will also touch on some key issues in the design of WCAN using modern integrated circuit technology such as coupling mechanisms and effects between on-chip antenna and inductor or coplanar waveguide.
报告题目： Antenna-in-Package (AiP) Technology: From Academic Curiosity to Industrial Reality
ABSTRACT: Antenna-in-package (AiP) technology that implements an antenna (or antennas) with a radio or radar die (or dies) into a standard surface-mounted device represents an important antenna technology achievement in recent years. AiP technology has been widely adopted by chipmakers for 60-GHz radios and gesture radars. It is strongly believed that AiP technology will also provide elegant antenna solutions to 5G and beyond operating in the lower millimeter-wave bands. An AiP should be designed together with the radio-frequency integrated circuit in the initial system architecture phase for optimum results. The fabrication of the AiP has always benefited from advanced packaging technologies such as low temperature co-fired ceramic (LTCC), fan-out wafer level packaging (FOWLP), and high-density interconnect (HDI) processes. Testing has to be considered along the whole manufacturing cycle. Probe-based measurement setups are suitable for AiP verification and characterization. Over-the-air (OTA) antenna measurements are required for production testing, integration and system level test.
This talk provides an introduction to AiP technology and an in-depth coverage of AiP topics to participants.
ZHANG Yueping is a full Professor of Electronic Engineering with the School of Electrical and Electronic Engineering at Nanyang Technological University, Singapore, a Distinguished Lecturer of the IEEE Antennas and Propagation Society (IEEE AP-S), and a Fellow of IEEE.
Prof. Zhang was a Member of the Field Award Committee of the IEEE AP-S (2015-2017), an Associate Editor of the IEEE Transactions on Antennas and Propagation (2010-2016), and the Chair of the IEEE Singapore MTT/AP joint Chapter (2012). Prof. Zhang was selected by the Recruitment Program of Global Experts of China as a Qianren Scholar at Shanghai Jiao Tong University (2012). He was awarded a William Mong Visiting Fellowship (2005) and appointed as a Visiting Professor (2014) by the University of Hong Kong.
Prof. Zhang has published numerous papers, including two invited papers in the Proceedings of the IEEE and one invited paper in the IEEE Transactions on Antennas and Propagation. He holds 7 US patents. He received the Best Paper Award from the 2nd IEEE/IET International Symposium on Communication Systems, Networks and Digital Signal Processing, July 18–20, 2000, Bournemouth, U.K., the Best Paper Prize from the 3rd IEEE International Workshop on Antenna Technology, March 21–23, 2007, Cambridge, U.K., and the Best Paper Award from the 10th IEEE Global Symposium on Millimeter-Waves, May 24–26, 2017, Hong Kong, China. He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012.
Prof. Zhang has made pioneering and significant contributions to the development of the antenna-in-package (AiP) technology that has been widely adopted by chipmakers for millimeter-wave applications. His current research interests include the development of antenna-on-chip (AoC) technology and characterization of chip-scale propagation channels at terahertz for wireless chip area network (WCAN).